- Semiconductor Packaging Test Handler System
An advanced final test (FT) handler for MEMS sensors and Memory/MCU:
JEDEC tray-compatible material handling
Array-type pick-and-place with 64 independently controlled nozzles
Nitrogen-free programmable tri-temperature system (±0.5°C precision)
Modular test stimulation chambers for sensor calibration
Mass production-proven performance with 40000+ UPH efficiency
- Application
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MEMS Pressure Sensor
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MEMS Temperature Sensor
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MEMS Gyroscope / Accelerometer Sensor
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Storage Chip
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Power Chip
- Related Products
MEMS Sensor Testing and Sorting System
MEMS
Sensor Testing and Sorting System
MEMS Sensor Testing and Sorting System
FUNCTION
- Automatic loading and unloading;
- Vision system checks if the tray contains materials and scans QR codes on product surfaces;
- Pressure testing;
- High/low-temperature testing;
- Automatic sorting of NG/PASS products.
FEATURE
- High efficiency, 30,000+ UPH
- High flexibility, compatible with multiple stimulation chambers
- Modular design, simple and quick COK changeover
- Tray-in/Tray-out, supports 30+ JEDEC Trays, compatible with multiple bin sorting
- Visual material recognition, posture recognition, QR code scanning, character recognition
- Compact structure, footprint: 2500*1720*2380 mm
APPLICATION
MEMS temperature sensors, MEMS pressure sensors, MEMS gyroscopes/acceleration sensors, memory semiconductors, power semiconductors
